• Seamless integration from virtual environment to physical deployment

• Accelerates new machine design concept and customers’ order decision making

• Reduces commissioning time for equipment launch to market by over 80%

• High-speed 16K CPH dual-wafer processing with one-step placement handoff.

• Sub-micron servo-driven precision for ultra-thin die and multi-die assembly.

• Flexible support for 52 unique wafer types and large-format panels.

• ±2 µm positional accuracy for the most complex semiconductor assemblies.

• 0.005° angular mastery ensure flawless component orientation with ultra-fine angular control

• Boost your production efficiency with up to 2X throughput compared to conventional alternative solutions

• High-precision gantry and multi-axis synchronization for robotic systems

• Boost cycle time with up to 3.5 kHz bandwidth and 40% faster settling

• Reduce energy consumption with a common DC bus design

• Fully compliant with the SEMI standards

• Features API interface and assisting tools for system configuration, and information simulation.

• Highly integrated with the SECS/GEM standards and supports most of the PLC communication protocols.

• Real time Monitoring software for various industries

• Flexible and scalable software suitable for seamless Equipment Integration

• User Friendly, Intuitive interface with high customizable functions

• Multi-layer Wi-Fi planning for reliable coverage

• Proactive roaming and intelligent load balancing for seamless device mobility

• Location-driven AI Ops for smarter operations