• Seamless integration from virtual environment to physical deployment

• Accelerates new machine design concept and customers’ order decision making

• Reduces commissioning time for equipment launch to market by over 80%

• High-accuracy, efficient multi-die and heterogeneous integration for 2D, 2.5D, 3D

• HPC, IoT, Automotive, Mobility, Industrial, Medical, Mil-Aero. Rigid to Thin board support

• One Platform combines die & passive placement. Best-in-class speed & precision

• 16K cph speed, 813 x 610mm placement area @ 10μm accuracy

• Supports wafer, tray, tape, tube, bulk, and direct die

• High-Speed Wafer Feeder (HSWF), fastest multi-die exchange with large wafer capacity

• Advanced Process Lab for optimization, materials guidance, and failure analysis

• Precise pick and place movement up to 10G Acceleration

• Enable soft landing at high speed from 0.1N minimum

• All in one unit Linear Pocket Actuator for ease of use

• Suitable for electronics and assembly, semiconductor related, and other small-scale z-axis applications

• Real time Monitoring software for various industries

• Flexible and scalable software suitable for seamless Equipment Integration

• User Friendly, Intuitive interface with high customizable functions

• Advanced security features for enhanced protection

• Redundant power supplies to ensure continuous operation

• Comprehensive disaster recovery measures for business continuity

• High reliability and resilience for mission-critical industrial applications

• A class-leading system designed for seamless integration with semiconductor facilities

• Featuring advanced conversion, efficient batteries, and smart control for reliable, high-quality power